S
Sentronic Systems

Technologies & Capabilities

Leveraging cutting-edge tools and methodologies to deliver world-class PCB designs.

Core Technologies

Advanced capabilities across the full spectrum of PCB design and manufacturing technologies.

Multi-Layer Boards

Advanced multi-layer PCB designs up to 48 layers with complex stackups.

Up to 48 layer designs
Optimized layer stackup
Blind and buried vias
Sequential lamination
Mixed dielectric materials
Controlled depth drilling
Multi-Layer Boards

High-Speed Design

Cutting-edge high-speed digital design for data rates exceeding 100Gbps.

100G/200G/400G/800G SerDes design
PCIe Gen 4/5/6 compliance
DDR4/DDR5 memory interfaces
USB 3.2/4.0 design
Differential signaling
Eye diagram optimization
High-Speed Design

Flexible Boards

Flex and rigid-flex PCB solutions for space-constrained applications.

Single and multi-layer flex
Rigid-flex combinations
Dynamic flex applications
Stiffener design
ZIF connector integration
Bend radius optimization
Flexible Boards

SMT Technology

Advanced surface mount technology with fine-pitch component support.

Fine-pitch BGA (0.4mm pitch)
Micro BGA and CSP
01005 component placement
QFN and LGA packages
Via-in-pad design
Component-under-package
SMT Technology

Impedance Control

Precise impedance control for high-speed signal integrity.

Controlled impedance lines
Single-ended impedance
Differential pairs (50/85/90/100Ω)
Coplanar waveguide
Microstrip and stripline
Tolerance analysis
Impedance Control

DFM / DFT / DFA

Design for manufacturing, testing, and assembly best practices.

DFM rule checking
Test point placement
JTAG/boundary scan
Panel optimization
Assembly fixture design
Cost optimization
DFM / DFT / DFA

Tools & Software

We possess core expertise in all these industry-leading software and tools for precision PCB design and analysis.

PCB Design
Cadence Allegro
PCB Design
Altium Designer
PCB Design
Mentor Graphics
SI/PI Analysis
HyperLynx

Standards & Compliance

Adherence to international standards ensuring quality, reliability, and compatibility.

IPC-2221 (Generic PCB Design)
IPC-2222 (Rigid Organic PCBs)
IPC-6012 (Qualification)
IPC-A-600 (Acceptability)
IPC-7351 (Component Footprints)
IEEE 802.3 (Ethernet)
PCI Express Specifications
JEDEC Standards (Memory)
USB Specifications
HDMI/DisplayPort Standards
MIL-STD-810 (Military)
DO-160 (Aerospace)

Technical Specifications

Our capabilities span a wide range of technical requirements and specifications.

Board Specifications

  • Max Layers:48 layers
  • Min Track/Space:3/3 mil
  • Min Via Size:6 mil
  • Max Board Size:24" x 36"
  • Board Thickness:0.2-6.0mm

High-Speed Capabilities

  • Max Data Rate:800 Gbps
  • PCIe:Gen 5/6
  • USB:4.0
  • DDR:DDR5
  • Ethernet:800GbE

Material Options

  • • FR-4 (Standard & High Tg)
  • • Rogers (RO4003C, RO4350B)
  • • Megtron 6/7
  • • Isola materials
  • • Polyimide (Flex)

Need Advanced PCB Technology?

Let's discuss how our advanced capabilities can meet your specific requirements.

Discuss Your Project